HLC Roadmapp

# Time Frame 2019 2020 2021
Production Sample
1 Impedance(%) ±10 ±8 ±6 ±6
2 Min.Laser Via 160 160 150 150
3 Min.Laser Land 300 300 270 250
4 Max. Aspect Ratio 0.9 0.9 1 1
5 Min. PTH Via Size 200 200 200 150
6 Min. Back Drill Design D+150 D+150 D+100 D+75
7 Surface Finish OSP / Inmmersion Ag ENIG / ENEPIG ENIG / ENEPIG
8 Min. Back Drill Design D+150 D+150 D+100 D+75
9 Layer Count < 18 < 24 < 42 < 62
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